Flash Copper

Improved Formula Provides Better Adhesion And Finer Plate

For more information on this product please email   accounts@surfacemonkey.com

Flash Copper Solution Part A, B and C

Initially, a special plating deposit called a ""flash" may be used to form a very thin (typically less than 0.1 micrometer thick) plating with high quality and good adherence to the substrate. This serves as a foundation for subsequent plating processes. A "Flash" uses a high current density and a bath with a low ion concentration. The process is slow, so more efficient plating processes are used once the desired "Flash" thickness is obtained.

 When making a 1.5 US Gallon(3.79litres) Kit you will need the following: 

• 1 x 2 Gallon Plating Tank & Lid
• Flash Copper™ Part A - 2 Quarts (946.35ml x 2)
• Flash Copper™ Part B - 1 Pint (473.18ml)
• Flash Copper™ Part C - 1 Pint (473.18ml)
• Distilled water 3 - Quarts (946.35ml x 3)
• 2 x 4" x 8" Copper Anodes and bandages
• 1 Heater/ Thermostat unit 55w, (34^oc)

Increases the bond of acid copper, Nickel and 
Copy Chrome™ to all substrates 

Flash Copper™ is a unique alkaline electrolytic 
copper plating process with covering 
and throwing powers greater than cyanide copper. 

Flash Copper™ is an outstanding pre-plate copper strike for bright nickel, acid copper, tin and solder plates. It is an excellent heat treat stop off plate and EMI shield.

It is also an excellent decorative finish for buttons, rivets, lighting fixtures and builders’ hardware. The copper plate can be readily blackened or oxidized for a variety of attractive antiqued finishes.

 There are no carbonates to be treated. It contains no strong chelators. It is supplied as a liquid concentrate, which is diluted with water.

 Flash Copper™ produces a fine grained, smooth, dense and ductile copper deposit, which is nonporous and has excellent bonding properties. The throwing and covering power of the non-cyanide process is superior to cyanide processes. This is especially evident in barrel plating. It has uniform low current density distribution with excellent micro-throw.

 The grain is smaller than cyanide copper, which increases the density of the deposit. This density provides excellent heat treat stop off and masking properties. The fine-grained Flash Copper™ deposit under nickel/chrome improves the overall corrosion resistance and helps to throw the nickel farther into the low current density areas.

 Flash Copper™ produces a softer and more ductile deposit than cyanide or acid copper. The soft deposit imparts improved adhesion and corrosion resistance and greatly improved resistance to thermal shock. It has a high deposit purity and hence no out-gassing with subsequent brazing, soldering or vacuum operations.

 Flash Copper™ is simple and inexpensive to use because it replenishes the copper in solution by dissolving the copper anode and here again it is a unique product with only one maintenance additive.

 Flash Copper™ Benefits

One solution serves as both a strike and a plate bath. 

Greater throwing power than acid copper 

Eliminates the inherent dangers of cyanide in the work 
place and improves employee health and safety. 

Flash Copper™ has excellent bath stability and high efficiency. 

The bath does not have to be dumped as with other baths due
to breakdown products or iron buildup. 

The bath is easily maintained by monitoring the pH and copper
metal concentration. 

It has a very wide operating window. 

Flash Copper™ is supplied as a liquid concentrate, which is diluted 
with an equal amount of distilled water. 

SHIPPING INFORMATION

Please note that our shipping prices are a higher than it would cost to send a normal parcel via the post, the reason for this is because any product that contains chemicals must be sent and packed as per the "hazardous goods" regulations, and be transported by a carrier that is licensed to be able to transport. we are unable to send by regular post as it is now a criminal offence to send undeclared hazardous goods.